Abstract: A novel wafer-level 3DIC structure named SoW-X (System-On-Wafer, eXtreme) is proposed to enable integration of up to 16 full-reticle sized ASICs, 80 HBM4 modules and 2.8K 224Gb/s long ranged ...
Abstract: The evolution of Digital Signal Processing (DSP) systems and embedded systems within the VLSI era has significantly impacted computational speed, chip size, and power consumption, ...
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